PM lays foundation stone of 3 semiconductor facilities
The 'Made in India' semiconductor chips will take the country towards self-reliance and modernity, says Narendra Modi
PTI
Dholera (Gujarat), 13 March
Prime Minister Narendra Modi on
Wednesday said when India commits, it delivers, referring to his government's
commitment to make the country a semiconductor manufacturing hub.
Modi was virtually addressing
people after laying the foundation stone of three semiconductor facilities of
about Rs1.25 lakh crore, which include two in Gujarat and one in Assam. "This
is a historic day as we are taking a strong step towards a bright future,"
Modi said.
The 'Made in India' semiconductor
chips will take the country towards self-reliance and modernity, he said. "When
India commits, India delivers and democracy also delivers," Modi said on
the promise to make the country a semiconductor manufacturing hub.
He said the earlier governments
committed scams of thousands of crores, but they could not invest thousands of
crores for the development of the semiconductor industry.
The three semiconductor projects
launched on Wednesday include India's first Fab facility at Dholera in Gujarat,
Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand in the
state, and an OSAT facility in Morigaon, Assam.
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